LOCATION
Cleanroom (Space Science basement 06)
CONTACTS
Faculty in Charge:
Rafael Verduzco (rafaelv@rice.edu)
DESCRIPTION
The Plasma Etch PE-100 is a benchtop reactive ion etch system used for sample cleaning and surface activation. It can also be used for some etch processes. The adjustable process parameters include RF power, gas flow, and time. Available process gases include O2, Ar, N2, CF4, and SF6.