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Nanofab Cleanroom: Oxford DRIE (Deep Reactive Ion Etch system)

Nanofab Cleanroom: Oxford DRIE (Deep Reactive Ion Etch system)

LOCATION

Cleanroom (Space Science basement 06)

PRICING

Rice User Fee: $60/hr

Non-Profit Fee: $94/hr

For Profit Fee: $300/hr

Rice Training Fee: $120/hr

Non-Profit Training Fee: $188/hr

For Profit Training Fee: $405/hr

CONTACTS

Training Contact:

Jing Guo, jg78@rice.edu

Carlos Gramajo, cg70@rice.edu

Nadia Pervez, np65@rice.edu

Faculty in Charge:

Rafael Verduzco (rafaelv@rice.edu)

DESCRIPTION

This Oxford Plasmalab System 100/ICP 180 is a reactive ion etch system capable of deep etching through the use of Bosch and/or cryogenic processes. It can accommodate substrates ranging from small dies (on top of a carrier wafer) all the way up to standard 4' (100 mm) wafers with one flat. The RF generator for directed RIE plasma provides up to 300 W, and the inductively-couple plasma (ICP) generator can provide up to 3000 W. A total of 8 process gases are available: Ar, BCl3, CF4, C4F8, Cl2, N2, O2, and SF6. Wafer chuck temperature controls allow for substrate temperature ranges of 6 to 30 °C (via chiller) or down to -150 °C (or more, via liquid nitrogen).  THE CRYOGENIC FEATURE IS TEMPORARILY OFFLINE, PENDING UPGRADED CRYOGENIC PIPING, ETA: Jan 2016.

More information about the Cleanroom can be found here.