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Plasma Therm versaline PECVD

Nanofab Cleanroom: Plasma-Enhanced Chemical Vapor Deposition System (PECVD)

Deposition of silicon-based materials for nanofabrication

LOCATION

Cleanroom (Space Science basement 06)

PRICING

Rice User Fee: $50/hr

Non-Profit Fee: $78.25/hr

For Profit Fee: $250/hr

Rice Training Fee: $100/hr

Non-Profit Training Fee: $156.50/hr

For Profit Training Fee: $500/hr

CONTACTS

Training Contact:

Jing Guo, jg78@rice.edu

Carlos Gramajo, cg70@rice.edu

Nadia Pervez, np65@rice.edu

Faculty in Charge:

Rafael Verduzco (rafaelv@rice.edu)

DESCRIPTION

The PlasmaTherm Versaline plasma-enhanced chemical vapor deposition (PECVD) system is capable of of depositing amorphous silicon, silicon nitride, silicon oxide, and silicon oxynitride materials on a variety of planar substrates. 

Process temperatures typically range from 200-300 degrees C. The system is equipped with a semi-automatic load-lock and a variety of substrate holders, enabling simultaneous high-uniformity batch processing of up to four 100 mm wafers or many more smaller substrates. 

This tool is also equipped with optical endpoint detection for improved process control and reliability. 

Cortex software interface is user-friendly and enables sophisticated process controls.

More information about the Cleanroom can be found here.