Nanofab Cleanroom Support Lab: Ball Wire Bonder
LOCATION
Cleanroom Support Lab (Space Science basement 020)
PRICING
Rice User Fee: $15/hr
Non-Profit Fee: $23.50/hr
For Profit Fee: $75/hr
Rice Training Fee: $30/hr
Non-Profit Training Fee: $47/hr
For Profit Training Fee: $150/hr
CONTACTS
Training Contact:
Jing Guo, jg78@rice.edu
Carlos Gramajo, cg70@rice.edu
Nadia Pervez, np65@rice.edu
Faculty in Charge:
Rafael Verduzco, rafaelv@rice.edu
DESCRIPTION
The West Bond 7KE Convertible Manual thermosonic wire bonder can support standard 45º wedge, deep access wedge, and ball banding processes. Standard processes utilize 1 mil (~25 micron) gold wire to create interconnects on or between electronic devices. A variety of device materials and applications can be successfully bonded with this tool by varying bonding parameters and/or operational modes. Accurate bond placement is achievable using the high precision micro-manipulator. The standard heated work holder for chips/dies can achieve temperatures up to 250ºC, but the open-access stage design allows for bonding applications on larger and non-traditional substrate holders and experimental apparatus. More information about the Cleanroom can be found here.