The West Bond 7KE Convertible Manual thermosonic wire bonder can support standard 45º wedge, deep access wedge, and ball banding processes. Standard processes utilize 1 mil (~25 micron) gold wire to create interconnects on or between electronic devices. A variety of device materials and applications can be successfully bonded with this tool by varying bonding parameters and/or operational modes. Accurate bond placement is achievable using the high precision micro-manipulator. The standard heated work holder for chips/dies can achieve temperatures up to 250ºC, but the open-access stage design allows for bonding applications on larger and non-traditional substrate holders and experimental apparatus. More information about the Cleanroom can be found here.